Researchers at the University of Adelaide have developed a breakthrough terahertz imaging technique that allows scientists to observe what is happening inside working electronic chips without touching them, taking them apart, or switching them off.
The new method uses terahertz waves – a safe, non-ionising form of electromagnetic radiation – to detect tiny movements of electrical charge inside fully packaged semiconductor devices. This gives engineers, for the first time, a way to monitor electronic components while they operate in real-world conditions.
Professor Withawat Withayachumnankul, group leader of the Terahertz Engineering Laboratory, said semiconductors underpin almost every modern technology, from smartphones and medical devices to vehicles, power grids and defence systems.
“Yet once a chip is sealed inside its protective packaging, it becomes extremely difficult to tell what is happening inside it,” he said.
“Most existing inspection methods require physical electrical probes, exposed chips, or devices to be powered down – making them impractical in many scenarios.”
The study, conducted with researchers from Virginia Diodes Inc (USA), the Hasso Plattner Institute (Germany) and the University of Potsdam (Germany), demonstrated that terahertz waves can non-invasively detect changes in electric current inside common components such as diodes and transistors.
To achieve this, the team developed an ultra-sensitive detection system using a specialised homodyne quadrature receiver, capable of isolating faint signals from electrical activity while cancelling background noise.
Professor Withayachumnankul said the result was a real-time view of electronics at work, even when the active region was buried deep inside sealed packaging.
Researchers believe the technology could improve diagnostics in high-power electronics, offer a safer alternative to X-ray inspection, and support defence and cybersecurity by helping verify the integrity of critical hardware.